Copper Wire Bonding

Copper wire has become the preferred material for wire bonding interconnects in many semiconductor and microelectronic applications because of its ability to be used at smaller diameters while providing the same performance as gold without the high material cost. ATEC takes pride in pioneering the development of copper wire bonding in place of gold wire in the Philippines.

Benefits of Using Copper Wire

Copper wire offers a significant cost advantage over gold wire. It is also an excellent replacement for gold wire due to its similar electrical properties. In addition, copper wire is almost the same in self-inductance and self-capacitance as gold wire. It also has a positive impact on circuit performance because of its low resistivity.

Copper Wire Bonding Milestones of ATEC